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19-3242; Rev 0; 4/04
150Mbps Automotive VCSEL Driver
General Description
The MAX3905 150Mbps automotive VCSEL driver implements low-cost transmitters operating from 8Mbps to 150Mbps at junction temperatures up to +140C. The device accepts single-ended TTL, differential PECL or LVDS input data, and provides bias and modulation currents for driving a VCSEL. The output is DC-coupled to the VCSEL to minimize component count. The driver provides temperature compensation to VCSEL high and low currents. Adjustments of the bias current, modulation current, bias-current temperature coefficient, and center of the temperature-stable bias current region are all programmable by wirebond options. The power-reduction feature decreases output modulation by approximately 50%. The data squelch feature disables the VCSEL current when no data is present. The MAX3905 is available in die form and operates from -40C to +140C junction temperature, over a +3.0V to +5.25V supply range.
Features
-40C to +140C Operating Junction Temperature Range +3.0V to +5.25V Supply Voltage TTL/CMOS-, LVDS-, or PECL-Compatible Data Input Compatible with SP1 Automotive Network Interface Wirebond-Adjustable VCSEL Low and High Currents Optical Power-Reduction Feature Output Squelch
MAX3905
Ordering Information
PART MAX3905E/D TEMP RANGE -40C to +140C PIN-PACKAGE Dice*
Applications
Optical Transmitters for Automotive Networks Polymer-Clad Silica Fiber-Based Networks
*Dice are designed to operate from TJ = -40C to +140C, but are tested and guaranteed at TA = +49C only.
Typical Application Circuits
+5V AUTOMOTIVE TRANSMITTER (TTL NETWORK CHIP INTERFACE, DATA RATE < 50Mbps) MODULATION CONTROL TRANSMIT OPTICAL SUBASSEMBLY (TOSA) DRIVER TO SET
VCC = +5V RGAIN
VCC SUPPLY FILTER
GAIN
TX TTL OUTPUT DATA (SP1 AUTOMOTIVE NETWORK INTERFACE)
3DB IN_TTL
MOD1
MOD2
DT01
DT02
VCC
OUT IN+
VCSEL
MAX3905
INSQEN DIFF LOW1 LOW2 TC1 TC2 TC3 VEE OUT
GND BIAS SET BIAS TEMPERATURE COEFFICIENT INDICATES OPTIONAL WIREBOND CONNECTION
Typical Application Circuits continued at end of data sheet.
________________________________________________________________ Maxim Integrated Products
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For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
150Mbps Automotive VCSEL Driver MAX3905
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, (VCC - VEE) ..................................-0.5V to +6.0V Voltage at 3DB, IN+, IN-, IN_TTL, DIFF, OUT, OUT, MOD1, MOD2, DT01, DT02, SQEN, TEMPSENS ..............................................-0.5V to (VCC + 0.5V) Voltage at LOW1, LOW2, TC1, TC2, TC3.................-0.5V to +2V Differential Input Voltage |IN+ - IN-|.......................................VCC Current into OUT...............................................................+12mA Storage Ambient Temperature Range...............-65C to +150C Operating Junction Temperature Range ...........-40C to +150C Electrostatic Discharge (ESD) (Human Body Model, tested per JES D22-A114) ...............2kV (Machine Model, tested per JES D22-A115) ..................+400V Die Attach Temperature...................................................+400C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +3.0V to +5.25V, TJ = -40C to +140C. Typical values are at VCC = +5.0V and TA = +25C, unless otherwise noted.)
PARAMETER OPERATING CONDITIONS Voltage at OUT Data Rate TTL Data Input-Edge Transition Time POWER SUPPLY Supply Current Supply Current While Data is Squelched CURRENT GENERATOR LOW1 open, LOW2 open Low Current (TJ = DT0) IDT0 LOW1 GND, LOW2 open LOW1 open, LOW2 GND LOW1 GND, LOW2 GND TC1 open, TC2 open, TC3 open Low-Current Positive Temperature Coefficient (TJ > DT0) TCLOW+ TC1 GND, TC2 open, TC3 open TC1 GND, TC2 GND, TC3 open TC1 GND, TC2 GND, TC3 GND TC1 open, TC2 open, TC3 open Low-Current Negative Temperature Coefficient (TJ < DT0) Width of Temperature-Stable Low-Current Region TCLOWTC1 GND, TC2 open, TC3 open TC1 GND, TC2 GND, TC3 open TC1 GND, TC2 GND, TC3 GND TW DT01 open, DT02 open Center of Temperature-Stable Low-Current Region DT0 DT01 VCC, DT02 open DT01 open, DT02 VCC DT01 VCC, DT02 VCC Modulation-Current Temperature Coefficient TCMOD Relative to IMOD at TJ = +25C 1.69 2.02 2.35 2.68 12 16 24 36 -18 -24 -36 -54 38 31.5 44 56 68.5 0.311 1.8 2.17 2.53 2.90 16 21 32 48 -16 -21 -32 -47 45 36 49 61 74 0.38 1.91 2.28 2.65 3.02 18 24 36 54 -12 -16 -24 -36 52 41.5 54 66 78.5 0.471 %/C C C A/C A/C mA ICC ISTDBY Excludes IOUT and IOUT Excludes IOUT and IOUT 14 14 25 mA mA VOUT With TTL input With differential input One-pole response, 10% to 90% 0.9 8 40 50 150 0.23 V Mbps UI SYMBOL CONDITIONS MIN TYP MAX UNITS
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150Mbps Automotive VCSEL Driver
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +3.0V to +5.25V, TJ = -40C to +140C. Typical values are at VCC = +5.0V and TA = +25C, unless otherwise noted.)
PARAMETER SYMBOL CONDITIONS MOD1 open, MOD2 open Modulation Current at TJ = +25C IMOD MOD1 VCC, MOD2 open MOD1 open, MOD2 VCC MOD1 VCC, MOD2 VCC Modulation Current in Low-Power Mode Modulation Switching Time Pulse-Width Variation Pulse-Width Distortion Data-Dependent Jitter Uncorrelated Jitter Deterministic Jitter Random Jitter IN_TTL DATA INPUT Input Low Input High Input Resistance Input Capacitance DIFFERENTIAL DATA INPUT Differential-Input Sensitivity Differential-Input Overload Differential-Input Resistance 3DB INPUT Input Threshold Voltage 3DB Input Voltage Diagnostic Resistor DATA SQUELCH Output Current While Squelched Time to Squelch Time to Resume from Squelch State ESD PROTECTION IN+, IN-, TTL_IN, 3DB Human Body Model Machine Model 4 400 kV V IOFF tSQ tRS No input data (Note 1) (Note 1) 1 3 8 0.1 50 25 5 A s s RGAINN RGAINL Normal mode Low-power mode VCC > 4.75V, normal mode VCC > 4.75V, low-power mode 29 2.0 0.8 16 1.5 V V k 1860 8 25 200 mVP-P mVP-P k (Note 1) VINL VINH -0.03 2.0 4 5.75 0.3 2 +0.80 VCC + 0.3 V V k pF ILP tr, tf PWV PWD DDJ UJ DJ RJ Relative to programmed nominal, TJ = +25C 20% to 80% (Note 1) (Notes 1, 2) (Notes 1, 2) (Notes 1, 2) (Notes 1, 2) K28.5 pattern at 125Mbps (Notes 1, 3) 1-0 pattern differential input (Note 1) 85 3 0.97 -0.02 0.004 MIN 2.84 3.44 4.03 4.62 40 TYP 3.01 3.65 4.28 4.91 50 0.2 MAX 3.22 3.88 4.55 5.22 60 0.5 1.03 +0.02 0.01 0.001 200 11 % ns UI UI UI UI psP-P psRMS mA UNITS
MAX3905
3
Note 1: These specifications are guaranteed by design and characterization. Note 2: Pulse-width variation, pulse-width distortion, data-dependent jitter, and uncorrelated jitter are measured at 45Mbps per MOST specification of physical Layer (revision 1.1). Note 3: Deterministic jitter is measured with a K28.5 pattern (0011 1110 1011 0000 0101). Deterministic jitter is the peak-to-peak deviation from ideal time crossings, measured at the 50% crossings of the output. Differential data applied to input. _______________________________________________________________________________________
150Mbps Automotive VCSEL Driver MAX3905
Typical Operating Characteristics
(LOW[1, 2] = [GND, open], MOD[1, 2] = [open, VCC], DT0[1, 2] = [open, open], TC[1, 2, 3] = [GND, GND, open], TA = +25C, unless otherwise noted.)
SUPPLY CURRENT vs. JUNCTION TEMPERATURE
EXCLUDES IOUT AND IOUT
MAX3905 toc01
ELECTRICAL EYE DIAGRAM (45.1Mbps TTL INPUT)
MAX3905 toc02
ELECTRICAL EYE DIAGRAM (150Mbps DIFFERENTIAL INPUT)
MAX3905 toc03
30 25 SUPPLY CURRETNT (mA) 20 15 10 5 0
K28.5 PATTERN
K28.5 PATTERN VCC = +3.3V
VCC = 5.0V
VCC = 3.3V
-40 -20
0
20
40
60
80 100 120 140
3.7ns/div
1.12ns/div
JUNCTION TEMPERATURE (C)
OPTICAL EYE DIAGRAM (45.1Mbps TTL INPUT)
MAX3905 toc04
OPTICAL EYE DIAGRAM (150Mbps DIFFERENTIAL INPUT)
MAX3905 toc05
BIAS CURRENT vs. JUNCTION TEMPERATURE
TC[1, 2, 3] = [GND, GND, OPEN] DT0[1, 2] = [OPEN, OPEN] LOW[1, 2] = [GND, GND] LOW[1, 2] = [OPEN, GND]
MAX3905 toc06
6 5 BIAS CURRETNT (mA) 4 3 2 1 0
VIN = 5.0V 850nm VCSEL 467MHz LOWPASS FILTER 3.7ns/div
VCC = 3.3V 850nm VCSEL 467MHz LOWPASS FILTER 1.12ns/div
LOW[1, 2] = [GND, OPEN] LOW[1, 2] = [OPEN, OPEN] -40 -20 0 20 40 60 80 100 120 140
JUNCTION TEMPERATURE (C)
BIAS CURRENT vs. JUNCTION TEMPERATURE
LOW[1, 2] = [GND, OPEN] DT0[1, 2] = [OPEN, OPEN] TC[1, 2, 3] = [GND, GND, GND] TC[1, 2, 3] = [GND, GND, OPEN]
MAX3905 toc07
MODULATION CURRENT vs. JUNCTION TEMPERATURE
7 MODULATION CURRENT (mA) 6 5 4 3 2 1 0 -40 -20 MOD[1, 2] = [VCC, OPEN] MOD[1, 2] = [OPEN, OPEN] 0 20 40 60 80 100 120 140 JUNCTION TEMPERATURE (C) MOD[1, 2] = [VCC, VCC] MOD[1, 2] = [OPEN, VCC]
MAX3905 toc08
7 6 BIAS CURRETNT (mA) 5 4 3 2 1 0
8
DT0 = +36C TC[1, 2, 3] = [GND, OPEN, OPEN] TC[1, 2, 3] = [OPEN, OPEN, OPEN] -40 -20 80 100 120 140 JUNCTION TEMPERATURE (C) 0 20 40 60
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150Mbps Automotive VCSEL Driver
Typical Operating Characteristics (continued)
(LOW[1, 2] = [GND, open], MOD[1, 2] = [open, VCC], DT0[1, 2] = [open, open], TC[1, 2, 3] = [GND, GND, open], TA = +25C, unless otherwise noted.)
DETERMINISTIC JITTER vs. JUNCTION TEMPERATURE
MOD[1, 2] = [OPEN, OPEN] MOD[1, 2] = [VCC, OPEN]
MAX3905 toc11
MAX3905
OUTPUT SQUELCH
MAX3905 toc09
OUTPUT RESUME FROM SQUELCH
MAX3905 toc10
120 100 80 60 40 20 MOD[1, 2] = [OPEN, VCC] MOD[1, 2] = [VCC, VCC]
VIN
VIN
OPTICAL POWER OUTPUT tSQ 2s/div
OPTICAL POWER OUTPUT tRS
DETERMINISTIC JITTER (psP-P)
150Mbps K28.5 PATTERN 0 40ns/div -40 -20 0 20 40 60 80 100 120 140 JUNCTION TEMPERATURE (C)
RANDOM JITTER vs. JUNCTION TEMPERATURE
5.5 RANDOM JITTER (psRMS) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 -40 -20 80 100 120 140 JUNCTION TEMPERATURE (C) 0 20 40 60
MAX3905 toc12
PULSE-WIDTH VARIATION AND AVERAGE PULSE-WIDTH DISTORTION
MAX3905 toc13
6.0
45.1Mbps TTL BIPHASE-CODED DATA
10ns/div
_______________________________________________________________________________________
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150Mbps Automotive VCSEL Driver MAX3905
Pad Description
PAD 1, 20, 26 2 3 4, 5, 6 7 NAME VEE DIFF IN_TTL N.C. IN+ Circuit Ground Differential-Input Data Enable. Leave open to enable the TTL data input, or connect to ground to enable the differential data input. Single-Ended Data Input, TTL. Compatible with SP1 automotive network interface. This input is active when DIFF is left open. No Connection Positive Differential-Data Input, PECL- or LVDS-Compatible. This high-impedance input is internally biased to approximately 1.4V and requires an external termination resistor and an AC-coupling capacitor. It is active when DIFF is connected to ground. Junction Temperature Sensor. Analog output corresponding to the junction temperature of the die. Leave open for normal use. Negative Differential-Data Input, PECL- or LVDS-Compatible. This high-impedance input is internally biased to approximately 1.4V and requires an external termination resistor and an AC-coupling capacitor. It is active when DIFF is connected to ground. Power Supply Driver T0 Programming Input. Sets the center temperature of lowest bias current. Connect to VCC or leave open. Driver T0 Programming Input. Sets the center temperature of lowest bias current. Connect to VCC or leave open. Modulation-Current Programming Input. Sets the modulation-current amplitude. Connect to VCC or leave open. Modulation-Current Programming Input. Sets the modulation-current amplitude. Connect to VCC or leave open. Complementary Data Output. Connect to VCC or VCSEL anode. Data Output. Connect to VCSEL cathode. Squelch Enable Input. Leave open to enable squelch or connect to ground to disable squelch. Power-Reduction Input. Compatible with TTL. When low, 3DB activates a test mode, which reduces output power by 50%. When 3DB is high, the modulation output is normal. See the Detailed Description section. Low-Current Temperature-Coefficient Programming Input. Sets the temperature coefficient of the bias current. Connect to GND or leave open. Do not connect to VCC. Low-Current Temperature-Coefficient Programming Input. Sets the temperature coefficient of the bias current. Connect to GND or leave open. Do not connect to VCC. Low-Current Temperature-Coefficient Programming Input. Sets the temperature coefficient of the bias current. Connect to GND or leave open. Do not connect to VCC. Low-Current Programming Input. Sets the VCSEL-low (bias) current at the temperature set by the DT0 pins. Connect to GND or leave open. Do not connect to VCC. Low-Current Programming Input. Sets the VCSEL-low (bias) current at the temperature set by the DT0 pins. Connect to GND or leave open. Do not connect to VCC. FUNCTION
8
TEMPSENS
9 10, 15 11 12 13 14 16 17 18 19 21 22 23 24 25
INVCC DT01 DT02 MOD2 MOD1 OUT OUT SQEN 3DB TC1 TC2 TC3 LOW1 LOW2
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150Mbps Automotive VCSEL Driver MAX3905
VCC
INPUT BUFFERS IN+ INGND MAX3905 OUTPUT DRIVER
OUT
OUT
OPEN IN_TTL SIGNAL DETECT SQUELCH MODULATION CURRENT GENERATOR IMOD DT0 SET TEMP IMOD BIAS CURRENT GENERATOR IBIAS IBIAS
DIFF
VCC
SQEN K
TEMP
VEE
TEMPSENS
3DB
MOD[1, 2]
DT0[1, 2]
TC[1, 2, 3]
LOW[1, 2]
Figure 1. Functional Diagram
Detailed Description
The MAX3905 is comprised of a differential LVDS- or PECL-compatible input buffer, a TTL-compatible input buffer, signal detection, DT0 set block, modulation-current generator, bias-current generator, and output driver (Figure 1). The device implements temperature compensation in the bias and modulation that can be customized to accommodate the variation of VCSEL properties with process and temperature. See Figure 2 and Table 1 for driver current and temperature coefficient definitions.
function. A small offset on the input ensures proper functioning of the squelch feature. A 1M resistor from IN- to ground or VCC creates a 7mV offset.
Signal Detection and Data Squelch
When no data transitions are present at the input, the signal detection issues a squelch signal to the bias and modulation current, disabling the VCSEL output. This ensures that the receiver IC can easily detect the difference between transmitter on and transmitter off. The squelch function is enabled when SQEN is left unconnected. The squelch function can be disabled by connecting SQEN to ground. With squelch enabled, the delay of the squelch function is suitable for use with biphase-encoded data (maximum of three consecutive identical digits (CIDs)) or 8B-/10Bencoded data (maximum five CIDs). To use the MAX3905 with scrambled data, disable the squelch function.
Input Buffers
The MAX3905 has two input buffers, one for TTL-compatible DC-coupled input data, and the other for ACcoupled, differential LVDS or PECL input data. The differential input is relatively high impedance. This allows external resistors to be configured in several ways to meet the AC- and DC-termination requirements of LVDS or PECL. The active data input buffer is set by the DIFF input. To select the single-ended TTL input, leave DIFF open. To select the differential input, connect DIFF to ground. When using the differential input buffer, input noise can be sufficient to prevent normal operation of the squelch
DT0 Set Block
Inputs DT01 and DT02 are the 2-bit control of the center of the temperature-stable region, DT0. The temperature set by DT0[1, 2] should correspond to the T0 of the VCSEL. Connect DT01 or DT02 to VCC to set the bit high, or leave open to set the bit low. The typical DT0 can be calculated by:
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150Mbps Automotive VCSEL Driver MAX3905
OUTPUT CURRENT AMPLITUDE
IHIGH TCMOD IMOD = IHIGH - ILOW ILOW DTO
TCLOW + TCMOD VCSEL CURRENT
IHIGH
TCLOW
ILOW TW JUNCTION TEMPERATURE TIME
Figure 2. Driver Current and Temperature Coefficient Definitions
Table 1. Driver Current and Temperature Coefficient Definitions
PARAMETER ILOW IHIGH IMOD DT0 IDT0 TW TCMOD TCLOW IOFF DESCRIPTION Total VCSEL current when the data input is logic-low. Total VCSEL current when the data input is logic-high. IHIGH - ILOW. The center of the temperature-stable lowcurrent region (TW). DT0 roughly corresponds to T0 of the VCSEL. ILOW at TJ = DT0. The size (in C) of the region where no temperature coefficient is applied to ILOW. The temperature coefficient applied to IMOD. The temperature coefficient applied to ILOW. This coefficient is negative below DT0 - TW/2 and positive above DT0 + TW/2. Total VCSEL current while squelched.
DT0 [36 + 13(DT01) + 25(DT02)]C where DT0[1, 2] = 1 when bonded to VCC; DT0[1, 2] = 0 when left open.
Modulation-Current Generator
The modulation-current generator provides wirebondselectable current amplitude with temperature compensation. The temperature coefficient (TCMOD) compensates for the slope-efficiency change of the VCSEL over temperature. The modulation current is set with inputs MOD1 and MOD2. Connect MOD1 or MOD2 to VCC to set the bit high, and leave open to set the bit low. The typical modulation current at +25C can be calculated by: IMOD [3.01 + (0.64 x MOD1) + (1.27 x MOD2)]mA where MOD[1, 2] = 1 when bonded to V CC ; MOD [1, 2] = 0 when left open. Power Reduction The power-reduction feature is useful for in-system test and diagnostics. When the 3DB input is low, the modulation current is reduced by 50%. When 3DB is high or VCC, the modulation output is normal. For compatibility with 5V POF transmitters, the power mode can be set by connecting a resistor from 3DB to VCC. A resistor RGAIN < RGAINN sets the normal power mode, while RGAIN > RGAINL sets the low-power mode.
Bias-Current Generator
The bias-current generator provides a current that closely tracks the VCSEL properties with temperature. This current is summed with the modulation current at the OUT pad. The bias current at T J = DT 0 is
8 _______________________________________________________________________________________
150Mbps Automotive VCSEL Driver
programmed by the LOW1 and LOW2 inputs. Connect LOW1 or LOW2 to ground to set the bit high, and leave open to set the bit low. Do not connect LOW1 or LOW2 to VCC. The typical low current at TJ = DT0 can be calculated by: ILOW [1.8 + (0.37 x LOW1) + (0.73 x LOW2)]mA where, LOW[1, 2] = 1 when bonded to ground; LOW[1, 2] = 0 when left open. The temperature coefficient of the bias current is programmed by the TC1, TC2, and TC3 inputs. Connect TC1, TC2, or TC3 to ground to set the bit high, and leave open to set the bit low. Do not connect TC1, TC2, or TC3 to VCC. The typical temperature coefficient of the bias current can be calculated by: TCLOW [16 + (5 x TC1) + (11 x TC2) + (16 x TC3)]A/C where, TC[1, 2, 3] = 1 when bonded to ground; TC[1, 2, 3] = 0 when left open.
Applications Information
Additional Design Assistance
For more information and design assistance, refer to Maxim Design Note HFDN-32.0: Output Current Calculator for the MAX3905. Load inductance on OUT and OUT should be matched within 1.5nH to minimize both jitter and supply noise generation.
MAX3905
Layout Considerations
Wire Bonding
For high-current density and reliable operation, the MAX3905 uses gold metalization. For best results, use gold-wire ball-bonding techniques. Exercise caution when wedge bonding. Die size is 1.52mm x 1.52mm (60 mils x 60 mils), and die thickness is 300m (12 mils). The bond-pad passivation opening is 93m x 93m and bond-pad metal thickness is 1.2m. Refer to Maxim Application Note HFAN-08.0.1: Understanding Bonding Coordinates and Physical Die Size for additional information on bondpad coordinates. Do not attempt to bond to the laser trim target.
Junction-Temperature Sensing
A temperature sensor is incorporated into the MAX3905 to aid in evaluation of thermal performance. The TEMPSENS voltage is proportional to the die junction temperature (approximately -1.39mV per C). The temperature of the die can be estimated as: 0.72C 1mV
Laser Safety and IEC 825
Using the MAX3905 VCSEL driver alone does not ensure that a transmitter design is compliant with IEC 825. The entire transmitter circuit and component selections must be considered. Determine the level of fault tolerance required by each application, and recognize that Maxim products are not designed or authorized for use as components in systems intended for surgical implant into the body, for applications intended to support or sustain life, or for any other application where the failure of a Maxim product could create a situation where personal injury or death may occur.
T(C) 597C - VTEMPSENS (mV) x
Output Driver
The OUT pad connects directly to the VCSEL cathode. The OUT pad must be connected to the VCSEL anode or to VCC. The minimum instantaneous voltage on the OUT pad is 0.9V.
_______________________________________________________________________________________
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150Mbps Automotive VCSEL Driver MAX3905
VCC
MAX3905
MAX3905
VCC
OUT OUT
IN_TTL
1.5V
VEE
VEE
Figure 3. IN_TTL Equivalent Input Structure
Figure 5. OUT/OUT Equivalent Output Structure
VCC
Chip Information
TRANSISTOR COUNT: 985 PROCESS: Silicon Bipolar GST-2 SUBSTRATE: Connected to VEE DIE SIZE: 1.52mm x 1.52mm (60mils x 60mils) DIE THICKNESS: 300m (12mils)
MAX3905
IN+ 5k 1.4V 5k IN-
VEE
Figure 4. IN+/IN- Equivalent Input Structure
10
______________________________________________________________________________________
150Mbps Automotive VCSEL Driver
Typical Application Circuits (continued)
+3.3V AUTOMOTIVE TRANSMITTER (TTL NETWORK CHIP INTERFACE, DATA RATE < 50Mbps) MODULATION CONTROL TRANSMIT OPTICAL SUBASSEMBLY (TOSA) DRIVER TO SET
MAX3905
VCC = +3.3V
SUPPLY FILTER
VCC
REDUCE POWER
TX TTL OUTPUT DATA (SP1 AUTOMOTIVE NETWORK INTERFACE)
3DB IN_TTL
MOD1
MOD2
DT01
DT02
VCC
OUT IN+
VCSEL
MAX3905
INSQEN DIFF LOW1 LOW2 TC1 TC2 TC3 VEE OUT
GND BIAS SET BIAS TEMPERATURE COEFFICIENT INDICATES OPTIONAL WIREBOND CONNECTION
TRANSMITTER WITH DIFFERENTIAL LVDS INTERFACE MODULATION CONTROL SUPPLY FILTER TRANSMIT OPTICAL SUBASSEMBLY (TOSA) DRIVER TO SET
VCC = +3.0V TO +5.25V
REDUCE POWER
3DB IN_TTL 0.1F NETWORK CHIP WITH LVDS OUTPUT 50 100 50 0.1F SQEN 1M DIFF ININ+
MOD1
MOD2
DT01
DT02
VCC
OUT
VCSEL
MAX3905
OUT
LOW1
LOW2
TC1
TC2
TC3
VEE
GND BIAS SET BIAS TEMPERATURE COEFFICIENT INDICATES OPTIONAL WIREBOND CONNECTION
______________________________________________________________________________________
11
150Mbps Automotive VCSEL Driver MAX3905
Typical Application Circuits (continued)
TRANSMITTER WITH DIFFERENTIAL-PECL INTERFACE MODULATION CONTROL SUPPLY FILTER TRANSMIT OPTICAL SUBASSEMBLY (TOSA) DRIVER TO SET
VCC = +3.0V TO +5.25V
REDUCE POWER
VCCPECL
3DB IN_TTL
MOD1
MOD2
DT01
DT02
VCC
R1 NETWORK CHIP WITH PECL OUTPUT 50
R1
0.1F IN+
OUT
VCSEL
MAX3905
50 R2 R2 0.1F SQEN 1M DIFF LOW1 LOW2 TC1 TC2 TC3 VEE INOUT
VCCPECL= 3.3V VCCPECL = 5V R1 R2 82 130 130 82 GND BIAS SET BIAS TEMPERATURE COEFFICIENT INDICATES OPTIONAL WIREBOND CONNECTION
Bonding Coordinates
PAD 1 2 3 4 5 6 7 8* 9 10 11 12 13 PAD NAME VEE DIFF IN_TTL N.C. N.C N.C IN+ TEMPSENS INVCC DT01 DT02 MOD2 COORDINATES (m) X 46.6 46.6 46.6 46.6 46.6 46.6 46.6 46.6 262.6 791.8 956.5 1121.2 1285.9 Y 1285.9 1134.7 983.5 832.3 511 359.8 208.6 46.6 46.6 46.6 46.6 46.6 46.6 PAD 14 15 16 17 18 19 20 21 22 23 24 25 26 PAD NAME MOD1 VCC OUT OUT SQEN 3DB VEE TC1 TC2 TC3 LOW1 LOW2 VEE COORDINATES (m) X 1285.9 1285.9 1285.9 1285.9 1285.9 1285.9 1285.9 1059.1 902.5 745.9 589.3 432.7 276.1 Y 257.2 427.3 594.7 759.4 921.4 1086.1 1285.9 1285.9 1285.9 1285.9 1285.9 1285.9 1285.9
Coordinates are for the center of the pad. Coordinate 0,0 is the lower left corner of the passivation opening for pad 8. *Index pad. Orient the die with this pad in the lower-left corner.
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150Mbps Automotive VCSEL Driver
Chip Topography
VEE (PAD 26) LOW2 (PAD 25) LOW1 (PAD 24) TC3 (PAD 23) TC2 (PAD 22) TC1 (PAD 21)
MAX3905
VEE (PAD 1)
VEE (PAD 20)
DIFF (PAD 2)
3DB (PAD 19)
IN_TTL (PAD 3)
SQEN (PAD 18)
N.C. (PAD 4)
OUT (PAD 17)
60mils 1.52mm OUT (PAD 16) N.C. (PAD 5) VCC (PAD 15) N.C. (PAD 6) MOD1 (PAD 14)
IN+ (PAD 7)
TEMPSENS (PAD 8)
MOD2 (PAD 13)
IN(PAD 9)
LASER TRIM TARGET 60mils 1.52mm
VCC (PAD 10)
DT01 (PAD 11)
DT02 (PAD 12)
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 13 (c) 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.

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